Wafer-level chip scale flexible wireless microsystem fabrication

Tzu Yuan Chao*, Yu-Ting Cheng

*Corresponding author for this work

研究成果: Conference contribution同行評審

3 引文 斯高帕斯(Scopus)

摘要

The paper demonstrates a low-cost flexible wireless microsystem fabrication technology combining the previously developed bumpless RFSOP scheme [1,2] with a special surface cleaning process to assemble a CMOS chip with an organic substrate (SU-8/PDMS) by Au-Au thermocompressive bonds (<200°C). About -15dB return loss and -0.8dB insertion loss @ 40GHz interconnecting structure and above 6MPa bonding strength make the technology practical for flexible wireless microsystem integration. Besides, taking advantage of chemical inertia of Au, a wafer-level sacrificial release process is performed for the low-cost fabrication.

原文English
主出版物標題2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
頁面344-347
頁數4
DOIs
出版狀態Published - 13 四月 2011
事件24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
持續時間: 23 一月 201127 一月 2011

出版系列

名字Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(列印)1084-6999

Conference

Conference24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
國家Mexico
城市Cancun
期間23/01/1127/01/11

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