Wafer-level chip scale flexible wireless microsystem fabrication

Tzu Yuan Chao; Yu-Ting Cheng

doi:10.1109/MEMSYS.2011.5734432

Wafer-level chip scale flexible wireless microsystem fabrication

Tzu Yuan Chao^*, Yu-Ting Cheng

^*Corresponding author for this work

電子工程學系

研究成果: Conference contribution › 同行評審

3 引文斯高帕斯（Scopus）

摘要

The paper demonstrates a low-cost flexible wireless microsystem fabrication technology combining the previously developed bumpless RFSOP scheme [1,2] with a special surface cleaning process to assemble a CMOS chip with an organic substrate (SU-8/PDMS) by Au-Au thermocompressive bonds (<200°C). About -15dB return loss and -0.8dB insertion loss @ 40GHz interconnecting structure and above 6MPa bonding strength make the technology practical for flexible wireless microsystem integration. Besides, taking advantage of chemical inertia of Au, a wafer-level sacrificial release process is performed for the low-cost fabrication.

原文	English
主出版物標題	2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
頁面	344-347
頁數	4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734432
出版狀態	Published - 13 四月 2011
事件	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico 持續時間: 23 一月 2011 → 27 一月 2011

出版系列

名字	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN（列印）	1084-6999

Conference

Conference	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
國家	Mexico
城市	Cancun
期間	23/01/11 → 27/01/11

存取文件

10.1109/MEMSYS.2011.5734432

Link to publication in Scopus

指紋深入研究「Wafer-level chip scale flexible wireless microsystem fabrication」主題。共同形成了獨特的指紋。

引用此

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Chao, TY & Cheng, Y-T 2011, Wafer-level chip scale flexible wireless microsystem fabrication. 於 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011., 5734432, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 頁 344-347, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 23/01/11. https://doi.org/10.1109/MEMSYS.2011.5734432

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