Utilization of low-melting temperature alloy with confined seal for reducing thermal contact resistance

Wen Xiao Chu, Po Hsiang Tseng, Chi-Chuan Wang*

*Corresponding author for this work

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

摘要

This paper investigates a novel design of thermal interface material (TIM) using low-melting temperature alloy (LMTA) with confined seal. For solid TIM like indium foil, the thermal contact resistance is reduced with the rise with contact pressure, and an apparent hysteresis phenomenon may occur during loading/unloading of contact pressure. For the solid-state TIM, the indium TIM outperforms those of copper, lead and tin TIMs. The molten LMTA can further reduce the thermal contact resistance, however, the overflow and dislocation problems are observed. Hence, a novel confined design by using LMTA with an annular metal seal is proposed that can completely prevent aforementioned problems. Yet the reliability of the novel TIM is also investigated after hundred thermal cycles.

原文English
文章編號114438
期刊Applied Thermal Engineering
163
DOIs
出版狀態Published - 25 十二月 2019

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