Using DEA for relative efficiency analysis of wafer fabrication facilities

Wan Ling Lin*, Chen Fu Chien, Wen-Chih Chen, Wen Chin Wu, Hsin Yin Wang, Ren Tsun Kuo, Ming Hsuan Chou

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

Semiconductor industry is capital-incentive, competitive, and having complicated manufacturing processes. It is essential to utilize resources efficiently to provide products and services for maintaining competitive advantages. Knowing whether the resource is properly utilized is the foundation for future improvements and/or production decision. Due to the disparate units involved, direct evaluation and comparison among the fabs is difficult. This study aims to develop a two-stage model for relative comparison on fabrication operations by adopting data envelopment analysis (DEA). The proposed model clearly defines and differentiates the performance of fab production, and provides an overall performance index while considering different aspects.

原文English
主出版物標題2008 International Symposium on Semiconductor Manufacturing, ISSM 2008
頁面125-128
頁數4
出版狀態Published - 1 十二月 2008
事件2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008 - Tokyo, Japan
持續時間: 27 十月 200829 十月 2008

出版系列

名字IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN(列印)1523-553X

Conference

Conference2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008
國家Japan
城市Tokyo
期間27/10/0829/10/08

指紋 深入研究「Using DEA for relative efficiency analysis of wafer fabrication facilities」主題。共同形成了獨特的指紋。

引用此