Through-silicon-via-based double-side integrated microsystem for neural sensing applications

Chih Wei Chang*, Po-Tsang Huang, Lei Chun Chou, Shang Lin Wu, Shih Wei Lee, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen Chi Lee, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong

*Corresponding author for this work

研究成果: Conference contribution同行評審

10 引文 斯高帕斯(Scopus)

摘要

Highly integrated and miniaturized neural sensing microsystems that provide stable observation, small form factor and biocompatible properties are crucial for brain function investigation and neural prostheses realization for capturing accurate signals from an untethered subject in his natural habitat [1, 2]. Such biomedical devices usually comprise sensors and CMOS circuits for biopotential acquisition, signal conditioning, processing and transmission. Many approaches have been reported, including stacked multichip [3, 4], microsystem with separated neural sensors [5] and monolithic packaged microsystem [6]. Regardless of the integration schemes, the collected weak signals from the sensor need to pass through a string of interconnections including wire bonding, flip-chip bonding and welding or soldering bonds to the processing circuits. The excessive interfaces and connections introduce noise and lead to bulky packaged systems.

原文English
主出版物標題2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
頁面102-103
頁數2
DOIs
出版狀態Published - 29 四月 2013
事件2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
持續時間: 17 二月 201321 二月 2013

出版系列

名字Digest of Technical Papers - IEEE International Solid-State Circuits Conference
56
ISSN(列印)0193-6530

Conference

Conference2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
國家United States
城市San Francisco, CA
期間17/02/1321/02/13

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