Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing

T. L. Shao, S. W. Liang, T. C. Lin, Chih Chen*

*Corresponding author for this work

研究成果: Article同行評審

48 引文 斯高帕斯(Scopus)

摘要

Three-dimensional simulations on current-density distribution in solder joints under electric current stressing were carried out by finite element method. Five underbump metallization (UBM) structures were simulated, including TiCr-CuCu thin-film UBM, AlNi (V) Cu thin-film UBM, Cu thick-film UBM, Ni thick-film UBM, and CuNi thick-film UBM. The maximum current density inside the solder occurs in the vicinity of the entrance of the Al trace into the solder joint, while there is no obvious current crowding effect in the substrate side of the joint. The crowding ratio, which is defined as the maximum current density inside the solder divided by the average value in the UBM opening, is as high as 24.7 for the solder with the TiCr-CuCu UBM. However, it decreases to 23.4, 13.5, 8.7, and 7.2 for the rest of the UBM structures, respectively. Solder joints with thick UBMs were found to have a better ability to relieve the current crowding effect. The simulation results are in reasonable agreement with limited published data. The solder joints with higher current crowding ratios have a shorter electromigration failure time.

原文English
文章編號044509
期刊Journal of Applied Physics
98
發行號4
DOIs
出版狀態Published - 15 八月 2005

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