Thermomigration of Ti in flip-chip solder joints

Hsiao Yun Chen, Han Wen Lin, Chien Min Liu, Yuan Wei Chang, Annie T. Huang, Chih Chen*

*Corresponding author for this work

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

指紋 深入研究「Thermomigration of Ti in flip-chip solder joints」主題。共同形成了獨特的指紋。

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science