Thermomigration of Ti in flip-chip solder joints

Hsiao Yun Chen, Han Wen Lin, Chien Min Liu, Yuan Wei Chang, Annie T. Huang, Chih Chen*

*Corresponding author for this work

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Titanium has a very large heat of transport value of -768 kJ mol -1. However, thermomigration of Ti in solder joints has not been examined. In this study, void formation was observed in non-current-stressed Al traces during electromigration and thermomigration tests of SnAg solder joints. Voids formed inside the traces located above the solder bumps with no current flow. We found that Ti thermomigration occurred in the joint, resulting in the reaction of Al and Cu, leaving voids behind in the Al trace.

原文English
頁(從 - 到)694-697
頁數4
期刊Scripta Materialia
66
發行號9
DOIs
出版狀態Published - 1 五月 2012

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