Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Hsiao Yun Chen, Chih Chen*

*Corresponding author for this work

研究成果: Article

33 引文 斯高帕斯(Scopus)

摘要

Thermomigration in Pb-free SnAg solder alloys is investigated during accelerated electromigration tests under 9.7 × 103 A/cm 2 at 150 °C. It is found that Cu-Sn intermetallic compounds (IMCs) migrate toward the cold end on the substrate side and, as a result, voids accumulate in the chip side for the bump with current flowing from the substrate end to the chip end. Theoretical calculations indicate that the thermomigration force is greater than the electromigration force at a thermal gradient above 400 °C/cm for this stressing condition. Copper atoms may migrate against current flow and become the dominant diffusion species. On the other hand, Ni-Sn IMCs did not migrate even under a huge thermal gradient of 1400 °C/cm. These findings provide more understanding on the thermomigration of metallization materials in flip-chip solder joints.

原文English
頁(從 - 到)983-991
頁數9
期刊Journal of Materials Research
26
發行號8
DOIs
出版狀態Published - 28 四月 2011

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