Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang*, A. M. Gusak, King-Ning Tu, Yi Shao Lai

*Corresponding author for this work

研究成果: Article

134 引文 斯高帕斯(Scopus)

摘要

We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration.

原文English
文章編號141911
期刊Applied Physics Letters
88
發行號14
DOIs
出版狀態Published - 3 四月 2006

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