Thermal management of a notebook computer

S. B. Chiang*, K. H. Chien, K. S. Yang, S. K. Wu, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this study, simulations are made to resolve a 100 W heat dissipating capacity of a portable PC in (with a CPU IHS size of 31 mm × 31 mm). The problem is investigated via a commercially available software (Icepak version 4.1). The present design incorporates heat pipe to convey heat from the hot spot towards the heat sinks. The heat sinks are optimized subject to heat loads and their locations. The calculated results of a double heat sinks design show a 30°C less temperature when compared to a single heat sink module. This is because double heat sinks design provides much more uniform temperature and eliminates the edge effect. Moreover, the effect of fin pitches is also examined in this study. It is found that the best performance is at a fin thickness of 0.2 mm and at a fin pitch of 2.4 mm. Depending on the optimal parameters of the thermal module, the chip temperature can be reduced to approximately 75°C.

原文English
主出版物標題Proceedings of the ASME Heat Transfer Division 2005
頁面831-835
頁數5
版本1
DOIs
出版狀態Published - 1 十二月 2005
事件2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, United States
持續時間: 5 十一月 200511 十一月 2005

出版系列

名字American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
號碼1
376 HTD
ISSN(列印)0272-5673

Conference

Conference2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
國家United States
城市Orlando, FL
期間5/11/0511/11/05

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