Thermal management of a 600V 25 A power module by liquid jet impingement is investigated. Experiments are conducted on a module with resistive heat sources mimicking heat dissipation from IGBTs and diodes. An array of 36 DI water jets, 145 - 200μm diameter, impinging on the base plate of the module, demonstrates a 3X and 4X enhancement of the heat dissipation capability compared to the traditional cold plate and air-cooled heat sink, respectively. If the power level is held constant, the device junction temperature is reduced by a factor of 3X. At a reduced system pressure (13% atmospheric), an efficient jet impingement boiling on the base plate leads to a device level (1cm 2 area) power density of 230W/cm 2. The corresponding module volumetric power density is 12MW/m 3, about 4X of water-cooled cold plate. Numerical simulations show that the liquid impingement cooling technique has potential to enhance the module output rating from its current level of 5.2KW to ∼20KW and ∼62KW, respectively, for silicon and silicon carbide devices.
|出版狀態||Published - 1 七月 2004|
|事件||42nd AIAA Aerospace Sciences Meeting and Exhibit - Reno, NV, United States|
持續時間: 5 一月 2004 → 8 一月 2004
|Conference||42nd AIAA Aerospace Sciences Meeting and Exhibit|
|期間||5/01/04 → 8/01/04|