Thermal management of a motor drive power module by liquid impingement cooling

Avijit Bhunia*, Qingjun Cai, Chung-Lung Chen

*Corresponding author for this work

研究成果: Paper

1 引文 斯高帕斯(Scopus)

摘要

Thermal management of a 600V 25 A power module by liquid jet impingement is investigated. Experiments are conducted on a module with resistive heat sources mimicking heat dissipation from IGBTs and diodes. An array of 36 DI water jets, 145 - 200μm diameter, impinging on the base plate of the module, demonstrates a 3X and 4X enhancement of the heat dissipation capability compared to the traditional cold plate and air-cooled heat sink, respectively. If the power level is held constant, the device junction temperature is reduced by a factor of 3X. At a reduced system pressure (13% atmospheric), an efficient jet impingement boiling on the base plate leads to a device level (1cm 2 area) power density of 230W/cm 2. The corresponding module volumetric power density is 12MW/m 3, about 4X of water-cooled cold plate. Numerical simulations show that the liquid impingement cooling technique has potential to enhance the module output rating from its current level of 5.2KW to ∼20KW and ∼62KW, respectively, for silicon and silicon carbide devices.

原文English
頁面10829-10837
頁數9
出版狀態Published - 1 七月 2004
事件42nd AIAA Aerospace Sciences Meeting and Exhibit - Reno, NV, United States
持續時間: 5 一月 20048 一月 2004

Conference

Conference42nd AIAA Aerospace Sciences Meeting and Exhibit
國家United States
城市Reno, NV
期間5/01/048/01/04

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