Thermal management design from chip to package for high power InGaN/sapphire LEDs applications

Ray-Hua Horng, C. C. Chiang, D. S. Wuu, H. I. Lin, Y. L. Tsai

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

The optical and thermal properties of blue InGaN/sapphire LEDs with a novel structure design for heat dissipation is investigated. The LED chip is designed to directly contact with a cup-shaped Cu heat spreader, and then mounted on a heat sink coated with a diamond-like film. The packaged LED chip with the novel heat dissipation design demonstrates superior light output power and reduced junction temperature as compared with the same LED chip packaged using conventional process.

原文English
主出版物標題ECS Transactions - State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9
頁面111-115
頁數5
版本7
DOIs
出版狀態Published - 1 十二月 2008
事件State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9 - 214th ECS Meeting - Honolulu, HI, United States
持續時間: 12 十月 200817 十月 2008

出版系列

名字ECS Transactions
號碼7
16
ISSN(列印)1938-5862
ISSN(電子)1938-6737

Conference

ConferenceState-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9 - 214th ECS Meeting
國家United States
城市Honolulu, HI
期間12/10/0817/10/08

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