Thermal-driven analog placement considering device matching

Po-Hung Lin*, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

*Corresponding author for this work

研究成果: Conference contribution同行評審

20 引文 斯高帕斯(Scopus)


With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

主出版物標題2009 46th ACM/IEEE Design Automation Conference, DAC 2009
出版狀態Published - 10 十一月 2009
事件2009 46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, CA, United States
持續時間: 26 七月 200931 七月 2009


名字Proceedings - Design Automation Conference


Conference2009 46th ACM/IEEE Design Automation Conference, DAC 2009
國家United States
城市San Francisco, CA

指紋 深入研究「Thermal-driven analog placement considering device matching」主題。共同形成了獨特的指紋。