Thermal-driven analog placement considering device matching

Po-Hung Lin*, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

*Corresponding author for this work

研究成果: Conference contribution同行評審

20 引文 斯高帕斯(Scopus)

摘要

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

原文English
主出版物標題2009 46th ACM/IEEE Design Automation Conference, DAC 2009
頁面593-598
頁數6
DOIs
出版狀態Published - 10 十一月 2009
事件2009 46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, CA, United States
持續時間: 26 七月 200931 七月 2009

出版系列

名字Proceedings - Design Automation Conference
ISSN(列印)0738-100X

Conference

Conference2009 46th ACM/IEEE Design Automation Conference, DAC 2009
國家United States
城市San Francisco, CA
期間26/07/0931/07/09

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