Thermal characterization of shrouded plate fin array on an LED backlight panel

Jin Cherng Shyu*, Keng Wei Hsu, Kai Shing Yang, Chi-Chuan Wang

*Corresponding author for this work

研究成果: Article同行評審

31 引文 斯高帕斯(Scopus)


This study experimentally investigates a 348 mm × 558 mm LED backlight panel consisting of 270 1-W LEDs and a plate-fin heat sink in an acrylic housing. Effects of shroud clearance, obstructions at entrance or exit on the overall performance are also examined. The results show that the heat transfer coefficient is very slightly reduced with the rise of shroud clearance from 0 mm to 5 mm, followed by a notable rise but it peaks at a shroud clearance between 10 and 20 mm. A further increase of shroud clearance leads a marginal decrease of heat transfer coefficient. It is found that the maximum temperatures within the LED panel are not necessarily located at the center region due to the edge effect. On the other hand, the temperature variation along the longitudinal direction indicates a local minimum Nusselt number occurring near the exit of LED panel. This unique phenomenon is associated with the development of velocity and temperature field, and is consistent with previous numerical examinations. On the other hand, the obstruction placed at the exit are often severe than at the entrance.

頁(從 - 到)2909-2915
期刊Applied Thermal Engineering
出版狀態Published - 1 十月 2011

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