The paper presents the electromigration behavior study of Cu-Ni nanocomposite for low-power electromagnetic microactuator fabrication. The nanocomposite is characterized based the striped with 50μm width and synthesized in the Cu plating bath with the 2g/L concentration of 50nm Ni nanopowders. About 2.03% Ni weight percentage in the Cu-Ni nanocomposite stripe is characterized using inductively coupled plasma mass spectrometer (ICP-MS). The drift velocity, critical length, critical product, and activation energy of the Cu-Ni nanocomposite are 565nm/hr, 14μm, 1714 A/cm, and 0.39eV respectively. In comparison with the values of Cu which are 88nm/hr, 20μm, 2365 A/cm, and 1.09eV, respectively, the poor electromigration behavior of the nanocomposite is dominated by the surface diffusion mechanism of Cu atoms due to the void formation in the interface between itself and the passivation oxide.