The electromigration investigation of Cu-Ni nanocomposites

Y. C. Chen*, Chia Wei Chu, Tzu Yuan Chao, Yu-Ting Cheng, Chih Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

摘要

The paper presents the electromigration behavior study of Cu-Ni nanocomposite for low-power electromagnetic microactuator fabrication. The nanocomposite is characterized based the striped with 50μm width and synthesized in the Cu plating bath with the 2g/L concentration of 50nm Ni nanopowders. About 2.03% Ni weight percentage in the Cu-Ni nanocomposite stripe is characterized using inductively coupled plasma mass spectrometer (ICP-MS). The drift velocity, critical length, critical product, and activation energy of the Cu-Ni nanocomposite are 565nm/hr, 14μm, 1714 A/cm, and 0.39eV respectively. In comparison with the values of Cu which are 88nm/hr, 20μm, 2365 A/cm, and 1.09eV, respectively, the poor electromigration behavior of the nanocomposite is dominated by the surface diffusion mechanism of Cu atoms due to the void formation in the interface between itself and the passivation oxide.

原文English
主出版物標題2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
頁面515-518
頁數4
DOIs
出版狀態Published - 1 六月 2012
事件7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
持續時間: 5 三月 20128 三月 2012

出版系列

名字2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Conference

Conference7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
國家Japan
城市Kyoto
期間5/03/128/03/12

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