The effect of pre-aging on the electromigration of flip-chip SnAg solder joints

Po Chun Yang*, Chien Chih Kuo, Chih Chen

*Corresponding author for this work

研究成果: Review article同行評審

4 引文 斯高帕斯(Scopus)

摘要

The effect of pre-aging on electromigration is investigated in this study using flip-chip SnAg solder joints. The solder joints were pre-aged at C for h, h, h, h, h, and h, and then they were subjected to electromigration tests of. A at C. It was found that the average failure time increased about three times when the joints were pre-aged for h to h. But it decreased when the joints were over-aged. It is proposed that the major contributor to the prolonged failure time may be the densification of the nickel and copper under-bump metalli ation UBM and the solder due to the aging treatment. The pre-aging treatment at C may stabili e the microstructure of the solder. The vacancies in the solder were annihilated during the heat treatment, causing a slower diffusion rate. In addition, the UBM structure became denser after the pre-aging process. Thus, the denser UBM structure may lead to slower consumption rates of the nickel and copper layers, resulting in the enhancement of electromigration resistance.

原文English
頁(從 - 到)77-80
頁數4
期刊JOM
60
發行號6
DOIs
出版狀態Published - 1 六月 2008

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