Temperature-to-Power Mapping for Smartphones

Hong Wen Chiou, Yu Min Lee, Shen Chung Hsu, Guan Jia Chen, Chi Wen Pan, Tai Yu Chen

研究成果: Conference contribution同行評審

摘要

When power consumption in smartphones becomes much higher, several significant impacts occur due to its small form factor, such as performance degradation and worse user experience. Thus, power estimation/mapping is essential and useful for dynamic power management and power model validation for smartphones. In this work, first, we build the power-to-temperature (P-to-T) equations for thermal sensors from the existing system-level thermal model and calibrate them using the least squares fitting. Furthermore, we develop an efficient method for the temperature-to-power (T-to-P) mapping, which obtains the power consumption of components by utilizing temperatures of thermal sensors. Experiments show that this work can estimate power profile efficiently for both steady-state and transient results.

原文English
主出版物標題Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
發行者IEEE Computer Society
頁面783-789
頁數7
ISBN(電子)9781728197647
DOIs
出版狀態Published - 七月 2020
事件19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020 - Virtual, Orlando, United States
持續時間: 21 七月 202023 七月 2020

出版系列

名字InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
2020-July
ISSN(列印)1936-3958

Conference

Conference19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020
國家United States
城市Virtual, Orlando
期間21/07/2023/07/20

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