SU-8 flexible ribbon cable for biomedical microsystem interconnection

Tzu Yuan Chao*, Kuei Shu Li, Yu-Ting Cheng

*Corresponding author for this work

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

The paper presents a flexible interconnecting scheme with a wafer-level process to fabricate a SU-8 flexible ribbon cable for biomedical microsystem interconnection. Combining with a low temperature Au-Au thermocompressive bond (<200°C), the cable with 40 metal lines can provide mechanical and electrical connections between biomedical probes and external circuit chips. ∼3.3 MPa shear bonding strength can be achieved between the contacts formed on a silicon based microprobe and the ribbon cable, respectively. Meanwhile, ∼8.82×10-7 Ω·cm2 specific contact resistance has been measured between the contacts formed on the SU-8 and CMOS substrates, respectively. The experimental results have shown potential applications of the flexible interconnecting scheme for the heterogeneous integration of biomedical microsystems.

原文English
主出版物標題NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
頁面622-625
頁數4
DOIs
出版狀態Published - 4 十月 2011
事件6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011 - Kaohsiung, Taiwan
持續時間: 20 二月 201123 二月 2011

出版系列

名字NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

Conference

Conference6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011
國家Taiwan
城市Kaohsiung
期間20/02/1123/02/11

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