Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

Cheng Ta Ko, Kai Ming Yang, Jim Wein Lin, Chih Lun Wang, Tzu Chieh Chou, Yu Tao Yang, Ting Yang Yu, Yu Hua Chen, Kuan-Neng Chen, Tzyy Jang Tseng

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).

原文English
主出版物標題Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁數1
ISBN(電子)9784904743034
DOIs
出版狀態Published - 13 六月 2017
事件5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
持續時間: 16 五月 201718 五月 2017

出版系列

名字Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Conference

Conference5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
國家Japan
城市Tokyo
期間16/05/1718/05/17

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