Solution-based silver nanowires filling into carbon nanotubes by microwave heating technology

Chung Yang Lee, Chu Jung Ko, Fu-Hsiang Ko*, Hsuen Li Chen, Tieh Chi Chu

*Corresponding author for this work

研究成果: Conference contribution

摘要

In this article, we have developed a one-step microwave -assisted filling technology, combining the simultaneous opening CNT endcap and silver nanowire formation. The filling reaction is operated on a closed vessel with in-line temperature and pressure control, and the filling time is significant decreasing to 2 hours.

原文English
主出版物標題Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
發行者Institute of Electrical and Electronics Engineers Inc.
頁面212-213
頁數2
ISBN(電子)4891140402, 9784891140403
DOIs
出版狀態Published - 1 一月 2003
事件International Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
持續時間: 29 十月 200331 十月 2003

出版系列

名字Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Conference

ConferenceInternational Microprocesses and Nanotechnology Conference, MNC 2003
國家Japan
城市Tokyo
期間29/10/0331/10/03

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  • 引用此

    Lee, C. Y., Ko, C. J., Ko, F-H., Chen, H. L., & Chu, T. C. (2003). Solution-based silver nanowires filling into carbon nanotubes by microwave heating technology. 於 Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 (頁 212-213). [1268716] (Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2003.1268716