Soft-mold-induced self-construction of polymer patterns under microwave irradiation

Fu-Hsiang Ko*, Chia Tien Wu, Mei Fen Chen, Jem Kun Chen, Tieh Chi Chu

*Corresponding author for this work

研究成果: Article

4 引文 斯高帕斯(Scopus)

摘要

In this study, the authors used a soft-mold-induced self-construction method to fabricate three-dimensional patterns under microwave irradiation for 1 min. The authors estimated the actual pattern growth temperature using a fluorescence probe technique. The temperature at which pattern growth originated was, by necessity, higher than the glass transition temperature of the novolak resist. Electrostatic forces and surface tension effects under the electromagnetic field contributed significantly to the pattern growth, and the use of an antisticking agent allowed easy demolding.

原文English
文章編號191901
期刊Applied Physics Letters
90
發行號19
DOIs
出版狀態Published - 17 五月 2007

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