Row-based area-array I/O design planning in concurrent chip-package design flow

Ren J. Lee*, Hung-Ming Chen

*Corresponding author for this work

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

IC-centric design flow has been a common paradigm when designing and optimizing a system. Package and board/system designs are usually followed by almost-ready chip designs, which causes long turn-around time communicating with package and system houses. In this paper, the realizations of areaarray I/O design methodologies are studied. Different from IC-centric flow, we propose a chip-package concurrent design flow to speed up the design time. Along with the flow, we design the I/O-bump (and P/G-bump) tile which combines I/O (and P/G) and bump into a hard macro with the considerations of I/O power connection and electrostatic discharge (ESD) protection. We then employ an I/O-row based scheme to place I/O-bump tiles with existed metal layers. By such a scheme, it reduces efforts in I/O placement legalization and the redistribution layer (RDL) routing. With the emphasis on package design awareness, the proposed methods map package balls onto chip I/Os, thus providing an opportunity to design chip and package in parallel. Due to this early study of I/O and bump planning, faster convergence can be expected with concurrent design flow. The results are encouraging and the merits of this flow are reassuring.

原文English
主出版物標題2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011
頁面837-842
頁數6
DOIs
出版狀態Published - 28 三月 2011
事件2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011 - Yokohama, Japan
持續時間: 25 一月 201128 一月 2011

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011
國家Japan
城市Yokohama
期間25/01/1128/01/11

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  • 引用此

    Lee, R. J., & Chen, H-M. (2011). Row-based area-array I/O design planning in concurrent chip-package design flow. 於 2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011 (頁 837-842). [5722307] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2011.5722307