RF interconnects for communications on-chip

Mau-Chung Chang, Eran Socher, Sai Wang Tam, Jason Cong, Glenn Reinman

研究成果: Conference contribution

47 引文 斯高帕斯(Scopus)

摘要

In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well.

原文English
主出版物標題ISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design
頁面78-83
頁數6
DOIs
出版狀態Published - 16 五月 2008
事件2008 ACM International Symposium on Physical Design, ISPD 2008 - Portland, OR, United States
持續時間: 13 四月 200816 四月 2008

出版系列

名字Proceedings of the International Symposium on Physical Design

Conference

Conference2008 ACM International Symposium on Physical Design, ISPD 2008
國家United States
城市Portland, OR
期間13/04/0816/04/08

指紋 深入研究「RF interconnects for communications on-chip」主題。共同形成了獨特的指紋。

  • 引用此

    Chang, M-C., Socher, E., Tam, S. W., Cong, J., & Reinman, G. (2008). RF interconnects for communications on-chip. 於 ISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design (頁 78-83). (Proceedings of the International Symposium on Physical Design). https://doi.org/10.1145/1353629.1353649