Reviews on latest advances in micro/nano-sized particles enhanced composite solders

Liang Zhang*, King-Ning Tu, Lei Sun, Yonghuan Guo, Chengwen He

*Corresponding author for this work

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

The investigation and application of lead-free solders bearing micro/nano-sized particles were reviewed synthetically. Moreover, the effects of additives such as metals, compounds, ceramics, carbon nano-tube, polymer on lead-free solders were reported and analyzed synchronously. Based on the works on microstructures, interface structure, melting temperature, mechanical property and creep behaviors, the effects of particles on properties and microstructures of solders were discussed systematically. In addition, the problems and difficulty in the process of the applications of lead-free solders bearing particles were analyzed synchronously, some suggestions were put forward on how to solve those problems mentioned above, and the prospect on lead-free solders with particle reinforcement was analyzed.

原文English
頁(從 - 到)49-65
頁數17
期刊Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology)
46
發行號1
DOIs
出版狀態Published - 26 一月 2015

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