A previously developed model for predicting interconnect electromigration time-to-failure under arbitrary current waveforms is shown to be applicable to Al-W intermetallic contacts as well. This model is incorporated in a circuit electromigration reliability simulator which can (1) generate layout advisory for width and length of each interconnect, the safety factor of each contact and via in a circuit to meet user-specified reliability requirements and (2) estimate the overall circuit electromigration failure rate and/or cumulative percent failure.
|頁（從 - 到）||111-118|
|期刊||Annual Proceedings - Reliability Physics (Symposium)|
|出版狀態||Published - 1 十二月 1990|
|事件||Twenty Eight International Reliability Physics Symposium 1990 - New Orleans, LA, USA|
持續時間: 27 三月 1990 → 29 三月 1990