Reducing the thermal resistance of LED die-attach material using Ni-coated diamond mixed with Sn-3 wt%Ag-0.5 wt%Cu solder

Tai Min Chang, Fu Hsin Chen, Meng Yen Chen, Yew-Chuhg Wu

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

High thermal resistance of LED die-attached (DA) material degraded LED's performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305.

原文English
頁(從 - 到)R140-R143
期刊ECS Journal of Solid State Science and Technology
4
發行號9
DOIs
出版狀態Published - 1 一月 2015

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