Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process

Chun Fu Lin, Hong Ren Fang, Jyh Rou Sze, Sheng-Fuu Lin, Chi Hung Hwang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

The major defect in integrated circuit wafers after the sawing process is the unexpected cracking from the sawing lane that damages the die area. Traditional defect detection algorithms for integrated circuit wafers after the sawing process can be divided into two parts. The first part is locating the sawing lane area and the second is detecting defects in the sawing lane area. The traditional methods take too long to locate the sawing lane area. To overcome this, this paper proposes a novel method for locating the sawing lane area using low-resolution and gray-value input images. After the sawing lane area is extracted from the original image, defects can be detected by traditional defect detection methods in the sawing lane area or by the method proposed in this paper. Using the proposed defect detection method is faster and better for real-time operation than traditional methods since the proposed method is more concise. Finally, a pioneering image data acquisition and inspection system for integrated circuit wafers after the sawing process is proposed in this paper. Furthermore, the proposed system works in real time because its architecture operates quickly and its proposed algorithm is simple, using low-resolution, gray-value images. Therefore, the proposed system can operate in real time and maintain a high-level detection rate.

原文English
主出版物標題I2MTC 2016 - 2016 IEEE International Instrumentation and Measurement Technology Conference
主出版物子標題Measuring the Pulse of Industries, Nature and Humans, Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781467392204
DOIs
出版狀態Published - 22 七月 2016
事件2016 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2016 - Taipei, Taiwan
持續時間: 23 五月 201626 五月 2016

出版系列

名字Conference Record - IEEE Instrumentation and Measurement Technology Conference
2016-July
ISSN(列印)1091-5281

Conference

Conference2016 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2016
國家Taiwan
城市Taipei
期間23/05/1626/05/16

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