Promising composite die-bonding materials for high-power GaN-based LED applications

Ray-Hua Horng*, Jhih Sin Hong, Yu Li Tsai, Chia Ju Chen, Chih Ming Chen, Dong Sing Wuu

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

指紋 深入研究「Promising composite die-bonding materials for high-power GaN-based LED applications」主題。共同形成了獨特的指紋。

Mathematics

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science