Physics and materials challenges for lead-free solders

King-Ning Tu*, A. M. Gusak, M. Li

*Corresponding author for this work

研究成果: Review article同行評審

328 引文 斯高帕斯(Scopus)

摘要

The properties and reliability issues of lead-free solders were reviewed in the light of the electronic industry's move towards environment-friendly lead-free soldering. The microstructure changes of solder joints when subjected to chemical, mechanical, electrical and thermal forces were studied. Spalling of intermetallic compound at interfaces in solder reactions was also studied. It was concluded that for certain high-end applications, the reliability of lead-containing solders cannot be relinquished.

原文English
頁(從 - 到)1335-1353
頁數19
期刊Journal of Applied Physics
93
發行號3
DOIs
出版狀態Published - 1 二月 2003

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