Physical Model for Rapid Thermal Annealing (RTA) Induced Mechanical Stress

Tingyou Lin*, Jian Hsing Lee, Cheng Tsung Wu, Shao Chang Huang, Chung Chin Hung, Chau-Chin Su

*Corresponding author for this work

研究成果: Conference contribution同行評審

摘要

For the first time, the deformation caused by rapid thermal annealing (RTA) induced the mechanical stress has been observed visually. Based on the observation, a theoretical model has been derived to estimate the deformation caused by RTA. The model is then verified through chip implementation and measurement.

原文English
主出版物標題4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781728125381
DOIs
出版狀態Published - 四月 2020
事件4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Penang, Malaysia
持續時間: 6 四月 202021 四月 2020

出版系列

名字4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings

Conference

Conference4th Electron Devices Technology and Manufacturing Conference, EDTM 2020
國家Malaysia
城市Penang
期間6/04/2021/04/20

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