Phone-nomenon: A system-level thermal simulator for handheld devices

Hong Wen Chiou, Yu-Min Lee, Shin Yu Shiau, Chi Wen Pan, Tai Yu Chen

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3.58% maximum error and 1.72°C difference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.

原文English
主出版物標題ASP-DAC 2019 - 24th Asia and South Pacific Design Automation Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面577-584
頁數8
ISBN(電子)9781450360074
DOIs
出版狀態Published - 21 一月 2019
事件24th Asia and South Pacific Design Automation Conference, ASPDAC 2019 - Tokyo, Japan
持續時間: 21 一月 201924 一月 2019

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference24th Asia and South Pacific Design Automation Conference, ASPDAC 2019
國家Japan
城市Tokyo
期間21/01/1924/01/19

指紋 深入研究「Phone-nomenon: A system-level thermal simulator for handheld devices」主題。共同形成了獨特的指紋。

引用此