Optimization design of cup-shaped copper heat spreaders for high-power InGaN/sapphire LEDs

Ching Bei Lin*, Ray-Hua Horng, Yu Li Tsai, Dong Sing Wuu, Heng I. Lin

*Corresponding author for this work

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

To improve light extraction efficiency and heat dissipation of sapphire-based light-emitting diodes (LEOs), we develop and optimize copper heat spreader which was electroformed in close contact with sapphire . On the basis of simulation results, an LED with copper lowers junction temperature when compared with the LED without copper. In addition, a copper-surrounded LED with protruded bottom surface exhibits almost the same thermal performance as that with flat bottom surface. In practical fabrication, all the LED samples with copper show significant reduction in junction temperature form 150.4°C for the original LED to less than 100°C at injection current of I A (∼ 3 W/mm2). The encapsulated LED at the same driven current yields an output power of ∼700 mW, which is 2.7 times higher than that of the original LED without copper.

原文English
主出版物標題IMPACT Conference 2009 International 3D IC Conference - Proceedings
頁面689-691
頁數3
DOIs
出版狀態Published - 1 十二月 2009
事件IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
持續時間: 21 十月 200923 十月 2009

出版系列

名字IMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
國家Taiwan
城市Taipei
期間21/10/0923/10/09

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