On effective flip-chip routing via pseudo single redistribution layer

Hsin Wu Hsu*, Meng Ling Chen, Hung-Ming Chen, Hung Chun Li, Shi Hao Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Due to the advantage of flip-chip design in power distribution but controversial peripheral IO placement in lower design cost, redistribution layer (RDL) is usually used for such interconnection. Sometimes RDL is so congested that the capacity for routing is insufficient. Routing therefore cannot be completed within a single layer even for manual routing. Although [2] proposed a routing algorithm that uses two layers of RDLs, but in practice the required routing area is a little more than one layer. We overcome this problem by adopting the concept of pseudo single-layer. With the heuristics for routing on mapped channels and observations on staggered pins to relieve vertical constraints, the area of 2-layer routing can be minimized and the routability is 100%. Comparisons of routing results between manual design, the commercial tool, and the proposed method are presented. We have shown the effectiveness on a real industrial case: it originally required fully manual design, the proposed method can finish RDL routing automatically and effectively.

原文English
主出版物標題Proceedings - Design, Automation and Test in Europe Conference and Exhibition, DATE 2012
頁面1597-1602
頁數6
DOIs
出版狀態Published - 24 五月 2012
事件15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012 - Dresden, Germany
持續時間: 12 三月 201216 三月 2012

出版系列

名字Proceedings -Design, Automation and Test in Europe, DATE
ISSN(列印)1530-1591

Conference

Conference15th Design, Automation and Test in Europe Conference and Exhibition, DATE 2012
國家Germany
城市Dresden
期間12/03/1216/03/12

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