Novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance

Kow-Ming Chang, I. Chung Deng, Yao Pin Tsai, Chan Yang Wen, Sy Jer Yeh, Shih Wei Wang, Jin Yea Wang

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

指紋 深入研究「Novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science