Novel positive-tone thick photoresist for high aspect ratio microsystem technology

Chien-Wen Hsieh, Y. S. Hsieh, C. R. Yang, Y. D. Lee*

*Corresponding author for this work

研究成果: Article

5 引文 斯高帕斯(Scopus)

摘要

A methacrylate copolymer combining chemically amplified concept and casting technique was developed as a novel thick photoresist for the UV-LIGA process. Photoresist layers up to 500 μm in thickness can be fabricated easily. Microstructures fabricated by the novel thick photoresist were demonstrated. At present, the ring-shape microstructures with 150 μm tall and 15 μm wide have been realized and the calculated aspect ratio is 10.

原文English
頁(從 - 到)326-329
頁數4
期刊Microsystem Technologies
8
發行號4-5
DOIs
出版狀態Published - 1 八月 2002

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