Nondestructive optical inspection system for the dicing street quality of copper/low-k wafer

Sheng Feng Lin, Cheng-Huan Chen, Cheng Yao Lo

研究成果: Conference contribution同行評審

摘要

To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.

原文English
主出版物標題2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015
發行者Institute of Electrical and Electronics Engineers Inc.
頁面77-81
頁數5
ISBN(電子)9781509003327
DOIs
出版狀態Published - 30 十一月 2015
事件21st IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2015 - Brasov, Romania
持續時間: 22 十月 201525 十月 2015

出版系列

名字2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015

Conference

Conference21st IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2015
國家Romania
城市Brasov
期間22/10/1525/10/15

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