New test structure to monitor contact-to-poly leakage in sub-90 nm CMOS technologies

Ming Chu King*, Albert Chin

*Corresponding author for this work

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

指紋 深入研究「New test structure to monitor contact-to-poly leakage in sub-90 nm CMOS technologies」主題。共同形成了獨特的指紋。

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science