Nano-roughening for reliable N/MEMS manufacture

研究成果: Conference contribution同行評審

摘要

This paper presents a nano-roughneneing technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening for NEMS hermetic encapsulation. The average roughnesses of silicon substarte before and after the modification are 0.4nm and 12.4nm respectively. The roughness increase can effectively provide more than 30% bonding strength enhancement and 8% leakage reduction.

原文English
主出版物標題Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
頁面153-156
頁數4
DOIs
出版狀態Published - 1 十二月 2006
事件1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS - Zhuhai, China
持續時間: 18 一月 200621 一月 2006

出版系列

名字Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS

Conference

Conference1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS
國家China
城市Zhuhai
期間18/01/0621/01/06

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