Multi-I/O and reconfigurable RF/wireless interconnect based on near field capacitive coupling and multiple access techniques

Mau-Chung Chang, V. Roychowdhury, L. Y. Zhang, S. N. Zhou, Z. Y. Wang, Y. C. Wu, P. X. Ma, C. S. Lin, Z. J. Kang

研究成果: Conference contribution同行評審

11 引文 斯高帕斯(Scopus)

摘要

Future ULSI interconnect system demands extremely high data transmission rate, multi-I/O service, reconfigurable and fault-tolerant computing/processing architecture and full compatibility with mainstream silicon CMOS and MCM technologies. In this paper, we present a novel RF/wireless interconnect system that provides a unique solution to those system needs. Unlike the traditional "passive" metal interconnect, the "active" RF/wireless interconnect is based on near-field capacitive coupling, low loss and dispersion-free microwave signal transmission and modern multiple-access algorithms. The proposed RF/wireless interconnect promises ultra-broad bandwidth (up to 100 GHz), simultaneous multi-I/O communications (up to 50/50 I/O sub-channels per shared microwave transmission medium) and reconfigurable network (programmable based on Frequency and/or Code Division Multiple Access). As the first step to prove the feasibility, we have realized a 2x2 CDMA transceivers based on 0.35 μm MOSIS CMOS process, which demonstrates the desired functions of capacitive coupling, guided wave transmission and reconfigurable multiple access.

原文English
主出版物標題Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000
發行者Institute of Electrical and Electronics Engineers Inc.
頁面21-22
頁數2
ISBN(電子)0780363272, 9780780363274
DOIs
出版狀態Published - 1 一月 2000
事件3rd IEEE International Interconnect Technology Conference, IITC 2000 - Burlingame, United States
持續時間: 5 六月 20007 六月 2000

出版系列

名字Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Conference

Conference3rd IEEE International Interconnect Technology Conference, IITC 2000
國家United States
城市Burlingame
期間5/06/007/06/00

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