Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition

C. Y. Liu*, King-Ning Tu

*Corresponding author for this work

研究成果: Article同行評審

53 引文 斯高帕斯(Scopus)

摘要

We have investigated the wetting angle, side band growth, and intermetallic compound formation of seven SnPb alloys on Cu ranging from pure Sn to pure Pb. The wetting angle has a minimum near the middle composition and increases toward pure Sn and pure Pb, but the side band growth has a maximum near the middle composition. The intermetallic compounds formed are Cu6Sn5 and Cu3Sn for the eutectic and high-Sn alloys, yet for the high-Pb alloys, only Cu3Sn can be detected. While no intermetallic compound forms between Cu and pure Pb, the latter nevertheless wets the former with an angle of 115°. The driving force of a wetting reaction, which may be affected by the free energy gain in compound formation, is discussed by assuming that rate of compound formation is fast.

原文English
頁(從 - 到)37-43
頁數7
期刊Journal of Materials Research
13
發行號1
DOIs
出版狀態Published - 1 一月 1998

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