Morphology and Bond Strength of Copper Wafer Bonding

Kuan-Neng Chen*, C. S. Tan, A. Fan, R. Reif

*Corresponding author for this work

研究成果: Article同行評審

136 引文 斯高帕斯(Scopus)

摘要

The morphology and bond strength of copper-bonded wafer pairs prepared under different bonding annealing temperatures and durations are presented. The interfacial morphology was examined by transmission electron microscopy while the bond strength was examined from a diesaw test. Physical mechanisms explaining the different roles of postbonding anneals at temperatures above and below 300°C are discussed. A map summarizing these results provides a useful reference on process conditions suitable for actual microelectronics fabrication and three-dimensional integrated circuits based on Cu wafer bonding.

原文English
期刊Electrochemical and Solid-State Letters
7
發行號1
DOIs
出版狀態Published - 9 二月 2004

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