Methodology to evaluate the robustness of integrated circuits under Cable Discharge Event

Tai Xiang Lai*, Ming Dou Ker

*Corresponding author for this work

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Cable Discharge Event (CDE) has been the main cause which damages the Ethernet interface. The transmission line pulsing (TLP) system has been the most important method to observe electric characteristics of the device under human-body-model (HBM) ESD stress. In this work, the long-pulse transmission line pulsing (LP-TLP) system is proposed to simulate the influence of CDE on the Ethernet integrated circuits, and the results are compared with conventional 100-ns TLP system. The experimental results have shown that the CDE robustness of NMOS device in a 0.25-μm CMOS technology is much worse than its HBM electrostatic discharge robustness.

原文English
主出版物標題2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC
發行者Institute of Electrical and Electronics Engineers Inc.
頁面499-502
頁數4
ISBN(列印)0780393392, 9780780393394
DOIs
出版狀態Published - 1 一月 2005
事件2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC - Howloon, Hong Kong
持續時間: 19 十二月 200521 十二月 2005

出版系列

名字2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC

Conference

Conference2005 IEEE Conference on Electron Devices and Solid-State Circuits, EDSSC
國家Hong Kong
城市Howloon
期間19/12/0521/12/05

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