Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

Hsiang Yao Hsiao*, Chih Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

摘要

Several simulation studies reported that a hot spot exists in flip-chip solder bumps under accelerated electromigration. Yet, there are no experimental data to verify it. In this paper, the temperature distribution during electromigration in flip-chip SnAg3.5 solder bumps is directly inspected using infrared microscopy. Two clear hot spots are observed in the bump. One is located at the region with peak current density, and the other one is at the bump edge under the current-feeding metallization on the chip side. Under a current stress of 1.06 × 104 A/cm2, the temperature in the two hot spots are 161.7 °C and 167.8 °C, respectively, which surpass the average bump temperature of 150.5 °C. In addition, effect of under-bump-metallization (UBM) thickness on the hot spots is also examined. It indicates that the hot-spot temperature in the solder bump increases for the solder joints with a thinner UBM. Electromigration test indicates that these hot spots have significant influence on the initial failure location.

原文English
主出版物標題10th Electronics Packaging Technology Conference, EPTC 2008
頁面639-643
頁數5
DOIs
出版狀態Published - 1 十二月 2008
事件10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
持續時間: 9 十二月 200812 十二月 2008

出版系列

名字10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
國家Singapore
城市Singapore
期間9/12/0812/12/08

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