Low temperature (<180°C) wafer-level and chip-level In-to-Cu and Cu-to-Cu bonding for 3D integration

Yu San Chien*, Yan Pin Huang, Ruoh Ning Tzeng, Ming Shaw Shy, Teu Hua Lin, Kou Hua Chen, Ching Te Chuang, Wei Hwang, Jin-Chern Chiou, Chi Tsung Chiu, Ho Ming Tong, Kuan-Neng Chen

*Corresponding author for this work

研究成果: Conference contribution同行評審

10 引文 斯高帕斯(Scopus)

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Chemical Compounds

Engineering & Materials Science