Learning and inferring human actions with temporal pyramid features based on conditional random fields

Shih Yao Lin, Yen Yu Lin, Chu Song Chen, Yi Ping Hung

研究成果: Chapter

4 引文 斯高帕斯(Scopus)

摘要

Finding an effective way to represent human actions is yet an open problem because it usually requires taking evidences extracted from various temporal resolutions into account. A conventional way of representing an action employs tem-porally ordered fine-grained movements, e.g., key poses or subtle motions. Many existing approaches model actions by directly learning the transitional relationships between those fine-grained features. Yet, an action data may have many similar observations with occasional and irregular changes, which make commonly used fine-grained features less reli-able. This paper presents a set of temporal pyramid features that enriches action representation with various levels of se-mantic granularities. For learning and inferring the proposed pyramid features, we adopt a discriminative model with latent variables to capture the hidden dynamics in each layer of the pyramid. Our method is evaluated on a Tai-Chi Chun dataset and a daily activities dataset. Both of them are collected by us. Experimental results demonstrate that our approach achieves more favorable performance than existing methods.
原文American English
主出版物標題2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
發行者Institute of Electrical and Electronics Engineers Inc.
頁面2617-2621
頁數5
ISBN(列印)9781509041176
DOIs
出版狀態Published - 16 六月 2017

出版系列

名字ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings

引用此

Lin, S. Y., Lin, Y. Y., Chen, C. S., & Hung, Y. P. (2017). Learning and inferring human actions with temporal pyramid features based on conditional random fields. 於 2017 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) (頁 2617-2621). (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2017.7952630