Investigation and effects of wafer bow in 3D integration bonding schemes

Kuan-Neng Chen, Y. Zhu, Wen-Wei Wu, R. Reif

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications.

原文English
頁(從 - 到)2605-2610
頁數6
期刊Journal of Electronic Materials
39
發行號12
DOIs
出版狀態Published - 1 十二月 2010

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