With the progress of recent smart society, demand for high performance low-power CMOS devices becomes stronger and stronger. Corresponding to the situation, the downsizing of CMOS device has been accelerated significantly. In order to solve the problem inherent in the downsizing, new structures and new materials are being aggressively introduced into MOSFETs. They are, for example, nanowire channel, metal/high-k gate stack, metal/silicide source/drain. In this paper, the status of the new material introduction to CMOS devices is described.