High-density (4.4F 2 ) NAND flash technology using Super-Shallow Channel Profile (SSCP) engineering

F. Arai*, N. Arai, S. Satoh, T. Yaegashi, E. Kamiya, Y. Matsunaga, Y. Takeuchi, H. Kamata, A. Shimizu, N. Ohtani, N. Kai, S. Takahashi, W. Moriyama, K. Kugimiya, S. Miyazaki, T. Hirose, H. Meguro, K. Hatakeyama, K. Shimizu, Shirota Riichiro

*Corresponding author for this work

研究成果: Conference article同行評審

13 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Chemical Compounds

Engineering & Materials Science