Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.
|頁（從 - 到）||95-101|
|期刊||Materials Research Society Symposium - Proceedings|
|出版狀態||Published - 1 十二月 1998|
|事件||Proceedings of the 1998 MRS Spring Meeting - San Francisco, CA, USA|
持續時間: 13 四月 1998 → 16 四月 1998