Finite Element Analysis of an Ultrasonic Vibration Device at High Temperatures

Lan Phuong Nguyen, Yen Pin Tsai, Jung Chung Hung, Yi Chun Hsieh, Ching-Hua Hung*

*Corresponding author for this work

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

Ultrasonic-vibration-assisted forming has been extensively adopted in plastic manufacturing processes. Ultrasonic vibration contributes to enhancing material formability and product quality and to reducing manufacturing costs by improving frictional conditions and increasing the temperature of materials. However, designing a suitable ultrasonic vibration system for processes conducted at high working temperatures, such as the ultrasonic vibration-assisted glass hot embossing process, is difficult because of complex thermal boundaries and material properties. In this study, an ultrasonic vibration system that can be used at high working temperatures was analyzed using the finite element method and ANSYS commercial software. The simulation results obtained from thermal, modal, and harmonic response analyses were compared with experimental measurements to confirm the validity of the numerical analysis. The resulting finite element module can be used in designing the components of ultrasonic vibration devices that can be used at high working temperatures.

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